Home > Through Hole PCB Assembly >

USB 2 Layer Through Hole PCB Assembly Customized SMT Through Hole

Product Categories

Huaswin Electronics Co.,Limited

Contact Now

USB 2 Layer Through Hole PCB Assembly Customized SMT Through Hole

Ask Lasest Price
Brand Name :	HUASWIN
Model Number :	HSPCBA1616
Certification :	ISO/UL/RoHS
Price :	Negotiation
Payment Terms :	T/T, Western Union, L/C
Supply Ability :	10,000pcs per month
Delivery Time :	15-20 working days

Add to Cart

Product Details
Company Profile

USB 2 Layer Through Hole PCB Assembly Customized SMT Through Hole

USB 2 layer PCB Assembly with Customized SMT Through Hole

Specifications:

Layer: 2 layer
Material: FR4
Board Thickness: 1.6mm
Surface Treatment: Lead free HASL
Solder Mask: Green
Size: 70mm*80mm
Copper Thickness: 1 oZ
Min. Hole Size: 0.1mm
Min. Line Width: 0.075mm
Min. Line Spacing: 0.075mm
Hole vias: Buried hole and blind holes

PCB capability and services:

1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test

Detailed Specification of PCB Manufacturing

1	layer	1-30 layer
2	Material	CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
3	Board thickness	0.2mm-6mm
4	Max.finished board size	800*508mm
5	Min.drilled hole size	0.25mm
6	min.line width	0.075mm(3mil)
7	min.line spacing	0.075mm(3mil)
8	Surface finish	HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
9	Copper thickness	0.5-4.0oz
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vacuum packing,Plastic bag
12	Outer packing	standard carton packing
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Certificate	UL,ISO9001,ISO14001,ROHS,TS16949
15	Profiling punching	Routing,V-CUT,Beveling

Detailed Specification of Pcb Assembly

1	Type of Assembly	SMT and Thru-hole
2	Solder Type	Water Soluble Solder Paste,Leaded and Lead-Free
3	Components	Passives Down to 0201 Size
		BGA and VFBGA
		Leadless Chip Carries/CSP
		Double-Sided SMT Assembly
		Fine Pitch to 08 Mils
		BGA Repair and Reball
		Part Removal and Replacement-Same Day Service
3	Bare Board Size	Smallest:0.25x0.25 Inches
3	Bare Board Size	Largest:20x20 Inches
4	File Formats	Bill of Materials
		Gerber Files
		Pick-N-Place File(XYRS)
5	Type of Service	Turn-Key,Partial Turn-Key or Consignment
6	Component Packaging	Cut Tape
		Tube
		Reels
		Loose Parts
7	Turn Time	15 to 20 days
8	Testing	AOI inspection
		X-Ray inspection
		In-Circuit testing
		Functional test

Product Tags:


*From:	Your email address is incorrect!
*To:	Huaswin Electronics Co.,Limited
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!